DocumentCode
3283193
Title
Impact of Epitaxial NiSi/sub 2/ Source/Drain on Short Channel Effect and Line Edge Roughness in Extremely Scaled MOSFETs
Author
Migita, S. ; Mise, N. ; Watanabe, Y. ; Kadoshima, M. ; Fujiwara, H. ; Ohno, M. ; Takaba, H. ; Iwamoto, K. ; Ogawa, A. ; Nabatame, T. ; Satake, H. ; Toriumi, A.
Author_Institution
MIRAI-AIST, Tsukuba
fYear
2005
fDate
7-9 Dec. 2005
Firstpage
111
Lastpage
112
Abstract
The impact of epitaxial NiSi2 S/D on MOSFET performance has been investigated. Atomically flat NiSi2/Si (111)-facet interface and straight S/D edges irrespective of the gate edge roughness contribute to suppressing SCE
Keywords
MOSFET; nickel compounds; silicon; surface roughness; MOSFET performance; NiSi2-Si; epitaxial nickel silicide source/drain; gate edge roughness; line edge roughness; short channel effect; Annealing; Atomic layer deposition; FETs; High K dielectric materials; High-K gate dielectrics; Impurities; MOS devices; MOSFETs; Schottky barriers; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2005 International
Conference_Location
Bethesda, MD
Print_ISBN
1-4244-0083-X
Type
conf
DOI
10.1109/ISDRS.2005.1596003
Filename
1596003
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