DocumentCode :
3283227
Title :
Micro preconcentrator with seedless electroplated gold as self-heating adsorbent
Author :
Alfeeli, Bassam ; Zareian-Jahromi, Mohammad A. ; Agah, Masoud
Author_Institution :
Dept. of Electr. & Comput. Eng., Kuwait Inst. for Sci. Res., Safat, Kuwait
fYear :
2009
fDate :
25-28 Oct. 2009
Firstpage :
1947
Lastpage :
1950
Abstract :
This paper introduces, for the first time, electrodeposited gold as a new adsorbent material for micro preconcentration applications. The thin film gold layer serves as both an adsorbent and a resistive heater thus allowing self-heating capability without the need for additional off or on-chip heaters. The self-heating adsorbent enhances the desorption efficiency, reduces power consumption, and is simple to fabricate. The gold layer is deposited by seedless electroplating on silicon microstructures embedded in the cavity of microfabricated preconcentrators (¿PCs). The presented devices have outer dimensions of 7 mm × 7 mm, total inner surface area of ~10 m2, total inner volume of ~6.5 ¿L, and encompass more than 3500 high-aspect-ratio (30 ¿m × 120 ¿m × 240 ¿m) pillars. The ¿PC design provided high surface to volume ratio, high adsorption capacity, and improved sample distribution. The performance of these ¿PCs has been evaluated by using the preconcentration factor of several samples as a performance metric. Preconcentration factors of 810, 6156, 405 has been determined for 1-propanol, methanol and acetone, respectively.
Keywords :
adsorption; desorption; electroplating; gold; masks; microfabrication; silicon; thin films; 1-propanol; Au; Si; acetone; adsorbent material; adsorption capacity; desorption efficiency; methanol; microfabricated preconcentrators; micropreconcentrator; power consumption; resistive heater; seedless electroplated gold; seedless electroplating; self-heating adsorbent; silicon microstructures; size 120 mum; size 240 mum; size 30 mum; size 7 mm; thin film gold layer; Anodes; Chemical analysis; Energy consumption; Etching; Fabrication; Gold; Micromechanical devices; Personal communication networks; Silicon; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2009 IEEE
Conference_Location :
Christchurch
ISSN :
1930-0395
Print_ISBN :
978-1-4244-4548-6
Electronic_ISBN :
1930-0395
Type :
conf
DOI :
10.1109/ICSENS.2009.5398342
Filename :
5398342
Link To Document :
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