• DocumentCode
    3283227
  • Title

    Micro preconcentrator with seedless electroplated gold as self-heating adsorbent

  • Author

    Alfeeli, Bassam ; Zareian-Jahromi, Mohammad A. ; Agah, Masoud

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Kuwait Inst. for Sci. Res., Safat, Kuwait
  • fYear
    2009
  • fDate
    25-28 Oct. 2009
  • Firstpage
    1947
  • Lastpage
    1950
  • Abstract
    This paper introduces, for the first time, electrodeposited gold as a new adsorbent material for micro preconcentration applications. The thin film gold layer serves as both an adsorbent and a resistive heater thus allowing self-heating capability without the need for additional off or on-chip heaters. The self-heating adsorbent enhances the desorption efficiency, reduces power consumption, and is simple to fabricate. The gold layer is deposited by seedless electroplating on silicon microstructures embedded in the cavity of microfabricated preconcentrators (¿PCs). The presented devices have outer dimensions of 7 mm × 7 mm, total inner surface area of ~10 m2, total inner volume of ~6.5 ¿L, and encompass more than 3500 high-aspect-ratio (30 ¿m × 120 ¿m × 240 ¿m) pillars. The ¿PC design provided high surface to volume ratio, high adsorption capacity, and improved sample distribution. The performance of these ¿PCs has been evaluated by using the preconcentration factor of several samples as a performance metric. Preconcentration factors of 810, 6156, 405 has been determined for 1-propanol, methanol and acetone, respectively.
  • Keywords
    adsorption; desorption; electroplating; gold; masks; microfabrication; silicon; thin films; 1-propanol; Au; Si; acetone; adsorbent material; adsorption capacity; desorption efficiency; methanol; microfabricated preconcentrators; micropreconcentrator; power consumption; resistive heater; seedless electroplated gold; seedless electroplating; self-heating adsorbent; silicon microstructures; size 120 mum; size 240 mum; size 30 mum; size 7 mm; thin film gold layer; Anodes; Chemical analysis; Energy consumption; Etching; Fabrication; Gold; Micromechanical devices; Personal communication networks; Silicon; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2009 IEEE
  • Conference_Location
    Christchurch
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-4548-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2009.5398342
  • Filename
    5398342