An image pixels based fast matching algorithm for Die Bonder targeting

Author

Wang, Zhou ; Zhang, Hai-Tao

Author_Institution

Dept. of Control Sci. & Eng., Huazhong Univ. of Sci. & Technol. (HUST), Wuhan, China

fYear

2011

fDate

15-17 April 2011

Firstpage

1155

Lastpage

1159

Abstract

Auto Die Bonder (ADB) is often encountered in the IC package field, whose key technical difficulty lies in quickly and accurately locating the bonding positions of the chips. In this paper, a normalized cross correlation (NCC) algorithm based on image pixels has been used to address this problem. By using iterated algorithm with simplified expression, the modified NCC (MNCC) is remarkably accelerated compared to the traditional one. Afterwards, the MCNN algorithm has been examined by experiments to locate the lead-frame pads, and the result shows its superiority in efficiency with satisfactory positioning accuracy.

Keywords

image matching; integrated circuit manufacture; integrated circuit packaging; microassembling; IC package field; auto die bonder; die bonder targeting; fast matching algorithm; image pixels; normalized cross correlation; Accuracy; Algorithm design and analysis; Correlation; Image resolution; Manganese; Pattern matching; Pixel; image-pyramid; lead-frame; normalized cross correlation; pattern matching;

fLanguage

English

Publisher

ieee

Conference_Titel

Electric Information and Control Engineering (ICEICE), 2011 International Conference on

Conference_Location

Wuhan

Print_ISBN

978-1-4244-8036-4

Type

conf

DOI

10.1109/ICEICE.2011.5777761

Filename

5777761