Title :
An image pixels based fast matching algorithm for Die Bonder targeting
Author :
Wang, Zhou ; Zhang, Hai-Tao
Author_Institution :
Dept. of Control Sci. & Eng., Huazhong Univ. of Sci. & Technol. (HUST), Wuhan, China
Abstract :
Auto Die Bonder (ADB) is often encountered in the IC package field, whose key technical difficulty lies in quickly and accurately locating the bonding positions of the chips. In this paper, a normalized cross correlation (NCC) algorithm based on image pixels has been used to address this problem. By using iterated algorithm with simplified expression, the modified NCC (MNCC) is remarkably accelerated compared to the traditional one. Afterwards, the MCNN algorithm has been examined by experiments to locate the lead-frame pads, and the result shows its superiority in efficiency with satisfactory positioning accuracy.
Keywords :
image matching; integrated circuit manufacture; integrated circuit packaging; microassembling; IC package field; auto die bonder; die bonder targeting; fast matching algorithm; image pixels; normalized cross correlation; Accuracy; Algorithm design and analysis; Correlation; Image resolution; Manganese; Pattern matching; Pixel; image-pyramid; lead-frame; normalized cross correlation; pattern matching;
Conference_Titel :
Electric Information and Control Engineering (ICEICE), 2011 International Conference on
Conference_Location :
Wuhan
Print_ISBN :
978-1-4244-8036-4
DOI :
10.1109/ICEICE.2011.5777761
