DocumentCode
3283438
Title
Development of transparent biochip platform for patch clamp technology
Author
Ken, Hao-Kai ; Kuo, Shin-Hung ; Li, Jheng-Jhang ; Chen, Chih-Yuan ; Luo, Ching-Hsing
Author_Institution
Inst. of Nanotechnol. & Microsyst. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear
2009
fDate
25-28 Oct. 2009
Firstpage
1180
Lastpage
1183
Abstract
In this study, we present a novel three-level pillars silicon master to fabricate the transparent polydimethylsiloxane (PDMS) biochip with 1 ¿m aperture. The three-level pillars silicon master was manufactured by photolithography and ICP etching processes. Especially, we use the IR (image reversal) mode to fabricate the third pillar in silicon master for increasing the successful rate. Due to the three-level pillars design, the needle-breaking rate was decreased. Through the array of three-level pillars silicon master, we can manufacture the transparent PDMS chip with mass production and high through-put system. After integrating with the microfluidic system and patch-clamping equipment, the chip capacitance was measured and analyzed with 10 mV voltage pulse. The chip capacitance is 1.6 ± 0.5 pF and open resistance is 2.39 ± 0.6 M¿.
Keywords
bioMEMS; biotechnology; elemental semiconductors; lab-on-a-chip; microfabrication; microfluidics; photolithography; polymers; silicon; sputter etching; ICP etching; Si; capacitance 1.6 pF; image reversal mode; microfluidic system; patch clamp technology; photolithography; resistance 2.39 Mohm; three-level pillar silicon master; transparent PDMS chip; transparent polydimethylsiloxane biochip; voltage 10 mV; Apertures; Capacitance; Clamps; Etching; Lithography; Manufacturing processes; Mass production; Microfluidics; Pulse measurements; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2009 IEEE
Conference_Location
Christchurch
ISSN
1930-0395
Print_ISBN
978-1-4244-4548-6
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2009.5398353
Filename
5398353
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