• DocumentCode
    3283438
  • Title

    Development of transparent biochip platform for patch clamp technology

  • Author

    Ken, Hao-Kai ; Kuo, Shin-Hung ; Li, Jheng-Jhang ; Chen, Chih-Yuan ; Luo, Ching-Hsing

  • Author_Institution
    Inst. of Nanotechnol. & Microsyst. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2009
  • fDate
    25-28 Oct. 2009
  • Firstpage
    1180
  • Lastpage
    1183
  • Abstract
    In this study, we present a novel three-level pillars silicon master to fabricate the transparent polydimethylsiloxane (PDMS) biochip with 1 ¿m aperture. The three-level pillars silicon master was manufactured by photolithography and ICP etching processes. Especially, we use the IR (image reversal) mode to fabricate the third pillar in silicon master for increasing the successful rate. Due to the three-level pillars design, the needle-breaking rate was decreased. Through the array of three-level pillars silicon master, we can manufacture the transparent PDMS chip with mass production and high through-put system. After integrating with the microfluidic system and patch-clamping equipment, the chip capacitance was measured and analyzed with 10 mV voltage pulse. The chip capacitance is 1.6 ± 0.5 pF and open resistance is 2.39 ± 0.6 M¿.
  • Keywords
    bioMEMS; biotechnology; elemental semiconductors; lab-on-a-chip; microfabrication; microfluidics; photolithography; polymers; silicon; sputter etching; ICP etching; Si; capacitance 1.6 pF; image reversal mode; microfluidic system; patch clamp technology; photolithography; resistance 2.39 Mohm; three-level pillar silicon master; transparent PDMS chip; transparent polydimethylsiloxane biochip; voltage 10 mV; Apertures; Capacitance; Clamps; Etching; Lithography; Manufacturing processes; Mass production; Microfluidics; Pulse measurements; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2009 IEEE
  • Conference_Location
    Christchurch
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-4548-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2009.5398353
  • Filename
    5398353