• DocumentCode
    3283481
  • Title

    Impact of the silicon layer thickness to the optical property of sandwich photonic crystal structure

  • Author

    Li, Fangqiang ; Li, Changzheng ; San, Haisheng ; Chen, Xuyuan

  • Author_Institution
    Pen-Tung Sah Micro-Nano Technol. Res. Center, Xiamen Univ., Xiamen, China
  • fYear
    2011
  • fDate
    20-23 Feb. 2011
  • Firstpage
    804
  • Lastpage
    807
  • Abstract
    One hexagonal lattice sandwich structure Al/SiO2/Si has been fabricated with different thickness of silicon layer based on Silicon-On-Insulator (SOI) wafer. The transmission spectrum in mid-infrared range is extremely sensitive to the variety of the thickness of silicon layer. An important characteristic is that the number of the coupled modes corresponding to the surface plasmon polaritons (SPPs) model is different with each thickness, especially at 4.08 micrometer, only one coupled mode emerged. This experiment result shows that Localized surface plasmon (LSP) coupled mode and quasi-cylindrical wave (Quasi-CW) resonant mode all have been involved in the enhanced optical transmission phenomenon (EOT), and different coupled mechanisms have strong interaction with each other. The experiment result further reveals the deeper underlying physics of the EOT phenomenon, and is significant to new design of some optical sensor devices based on enhanced optical transmission phenomenon.
  • Keywords
    aluminium; elemental semiconductors; optical lattices; photonic crystals; polaritons; silicon; surface plasmons; Al-SiO2-Si; Si; localized surface plasmon coupled mode; optical lattice sandwich structure; optical sensor devices; optical transmission phenomenon; photonic crystal structure; quasi-cylindrical wave resonant mode; silicon-on-insulator wafer; surface plasmon polaritons model; Optical films; Optical surface waves; Plasmons; Silicon; Stimulated emission; Surface waves; IR emitter; Quasi-CW; SPPs; photonic crystal;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
  • Conference_Location
    Kaohsiung
  • Print_ISBN
    978-1-61284-775-7
  • Type

    conf

  • DOI
    10.1109/NEMS.2011.6017476
  • Filename
    6017476