Title :
FDTD simulation of power/ground bounce and crosstalk in IC packages
Author :
Falconer, M. ; Tripathi, Vaibhav
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR
Abstract :
Power/ground plane currents and pin coupling in an IC package are simulated using a general 3D Finite Difference Time Domain (FDTD) method with PML boundaries. This leads to better modeling and simulation of ground bounce and proximity effects
Keywords :
crosstalk; finite difference time-domain analysis; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; 3D FDTD simulation; IC packages; PML boundaries; crosstalk; pin coupling; power/ground bounce; proximity effects;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564819
