DocumentCode
3283891
Title
FDTD simulation of power/ground bounce and crosstalk in IC packages
Author
Falconer, M. ; Tripathi, Vaibhav
Author_Institution
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR
fYear
1996
fDate
28-30 Oct 1996
Firstpage
166
Lastpage
168
Abstract
Power/ground plane currents and pin coupling in an IC package are simulated using a general 3D Finite Difference Time Domain (FDTD) method with PML boundaries. This leads to better modeling and simulation of ground bounce and proximity effects
Keywords
crosstalk; finite difference time-domain analysis; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; 3D FDTD simulation; IC packages; PML boundaries; crosstalk; pin coupling; power/ground bounce; proximity effects;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564819
Filename
564819
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