DocumentCode
3284011
Title
A differential capacitive sensing circuit for micro-machined omnidirectional microphone
Author
Huang, Jung-Tang ; Chen, Kai-Si ; Chien, Chu-Che
Author_Institution
Dept. of Inst. of Mechatron. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
fYear
2011
fDate
20-23 Feb. 2011
Firstpage
948
Lastpage
951
Abstract
This paper presents a low-noise differential capacitive sensing circuit for omnidirectional microphone to detection accurate sound-source. The adaptive readout circuitry supports high-resolution signal acquisition from capacitive, resistive, voltage and current mode sensors. The chip was fabricated in TSMC 0.35um 2P4M CMOS process, its area is 2.31*2.39μm2, dissipates 6mW at 3.3V in a typical sensors application utilizing periodic sleep mode, and can read out a wide range of sensors with high sensitivity. The circuit includes a non-overlap clock generator and highly sensitive readout amplifier. Fully differential structure provides good noise suppression ability. And the amplifier offset can be eliminated by the Correlated Double Sampling (CDS). It achieves low noise performance while capacitors variation from 100fF to 3pF. This paper presents a circuit of tiny capacitor sensor.
Keywords
CMOS analogue integrated circuits; capacitive sensors; micromachining; microphones; readout electronics; CDS; CMOS process; TSMC; correlated double sampling; current mode sensors; high sensitivity; high-resolution signal acquisition; highly sensitive readout amplifier; low-noise differential capacitive sensing circuit; micromachined omnidirectional microphone; noise suppression ability; nonoverlap clock generator; power 6 mW; resistive sensors; size 0.35 mum; voltage 3.3 V; voltage sensors; Capacitive sensors; Capacitors; Integrated circuit modeling; Micromechanical devices; Microphones; Noise; capacitive circuit; capacitive sensing circuit; charge amplifier; cmos; correlated double sampling; omnidirectional microphone;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on
Conference_Location
Kaohsiung
Print_ISBN
978-1-61284-775-7
Type
conf
DOI
10.1109/NEMS.2011.6017511
Filename
6017511
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