DocumentCode
3284346
Title
A micromachined resonant pressure sensor with DETFs resonator and differential structure
Author
Wang, Junbo ; Chen, Deyong ; Liu, Lei ; Wu, Zhengwei
Author_Institution
State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Beijing, China
fYear
2009
fDate
25-28 Oct. 2009
Firstpage
1321
Lastpage
1324
Abstract
A novel micromachined resonant pressure sensor designed with DETFs (double-ended tuning forks) resonant beam and differential structure was put forward in this paper. Three groups of DETFs resonant beams form the differential structure to achieve the better sensitivity and make the sensor free of the environment changes. Four beams with the same size compose the DETFs to improve the Q-factor of the sensor. The structural parameters were optimized through FEM (finite elements method) analysis. The boron diffused silicon processes was used to realize the pressure sensor on single silicon wafer to simplify the fabrication process. Experiments show that the Q-factors of all groups of resonant beams are beyond 10000 and the sensitivity of the sensor is about 353 Hz/kPa when pressure varying from 0 to 100 kPa.
Keywords
Q-factor; finite element analysis; microsensors; pressure sensors; DETF resonator; Q-factor; boron diffused silicon processes; differential structure; double-ended tuning forks; finite elements method; micromachined resonant pressure sensor; pressure 0 kPa to 100 kPa; resonant beam; Boron; Fabrication; Frequency; Packaging; Q factor; Resonance; Sensor phenomena and characterization; Silicon; Temperature sensors; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2009 IEEE
Conference_Location
Christchurch
ISSN
1930-0395
Print_ISBN
978-1-4244-4548-6
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2009.5398404
Filename
5398404
Link To Document