Title :
Heat and Temperature in Micromechanical Systems
Author :
Talghader, Joseph J.
Abstract :
This paper covers some of the basic thermal phenomena seen in micromechanical devices beginning with basic heat transfer through devices and interfaces and continuing with discussion of thermal expansion deformation and thermomechanical noise. Some new materials and applications is also discussed including negative thermal expansion thin films and tunable thermal sensors
Keywords :
heat transfer; micromechanical devices; thermal expansion; heat transfer; micromechanical systems; negative thermal expansion thin films; thermal expansion deformation; thermal phenomena; thermomechanical noise; tunable thermal sensors; Heat transfer; Micromechanical devices; Nonhomogeneous media; Sensor phenomena and characterization; Temperature; Thermal degradation; Thermal expansion; Thermal sensors; Thin film sensors; Working environment noise;
Conference_Titel :
Semiconductor Device Research Symposium, 2005 International
Conference_Location :
Bethesda, MD
Print_ISBN :
1-4244-0083-X
DOI :
10.1109/ISDRS.2005.1596083
