Wireless packaging, a system requirements view

Summary form only given. World-wide markets for portable, wireless communication have experienced exponential growth and the trend is expected to continue for several years. Besides the ever increasing semiconductor integration level, packaging and interconnection technologies are going to drive product functionality, cost, size, and weight which ultimately determine the financial success or failure of a wireless product. The high-speed digital and mixed-mode circuits of wireless products pose special requirements on design tools. Many approaches are now available to tackle the purely functional aspects but issues such as digital noise coupling and interconnect simulation need further work. On a more general level, the EMI/EMC issue must be addressed. Tools to verify EMI/EMC compliance during the design cycle are largely lacking. Traditionally, cost and performance are cited as wireless packaging drivers. This is undoubtedly true but other emerging trends can be seen, too. For example, environmental practices such as recycling and manufacturers´ take-back responsibility are going to be widely applied, at least in Europe, by the end of this decade. Future wireless packaging must consider this changing scenario