Common platform for packaging micromachined devices

This paper presents a common platform for packaging micromachined devices, such as motion sensors, microphones, actuator RF switches etc. The method utilizes the semiconductor process, MEMS technique and Electroless technique to build the CMOS-MEMS chip and the second chip, which are then bonded together face to face. Herein, the second chip can further contain Micro Controller Unit (MCU) or antenna system, which can efficiently enhance the performances of CMOS-MEMS sensor without occupying extra packaging area and increasing the process cost. Moreover, the second chip is designed to a common platform which can serve different size or several micromachined components of CMOS-MEMS chip in a single platform.