Common platform for packaging micromachined devices

Author

Huang, Jung-Tang ; Lin, Ming-Jhe ; Hsu, Hou-Jun ; Tsai, Ting-Chiang

Author_Institution

Dept. of Inst. of Mechatron. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan

fYear

2011

fDate

20-23 Feb. 2011

Firstpage

1149

Lastpage

1153

Abstract

This paper presents a common platform for packaging micromachined devices, such as motion sensors, microphones, actuator RF switches etc. The method utilizes the semiconductor process, MEMS technique and Electroless technique to build the CMOS-MEMS chip and the second chip, which are then bonded together face to face. Herein, the second chip can further contain Micro Controller Unit (MCU) or antenna system, which can efficiently enhance the performances of CMOS-MEMS sensor without occupying extra packaging area and increasing the process cost. Moreover, the second chip is designed to a common platform which can serve different size or several micromachined components of CMOS-MEMS chip in a single platform.

Keywords

CMOS integrated circuits; electronics packaging; microcontrollers; micromachining; microsensors; CMOS-MEMS chip; CMOS-MEMS sensor; MCU; MEMS technique; actuator RF switch; antenna system; electroless technique; microcontroller unit; micromachined device; microphone; motion sensor; packaging; semiconductor process; Copper; Gas detectors; Intelligent sensors; Micromechanical devices; Packaging; Temperature sensors; Electroless technology; Micro Controller Unit (MCU); micromachined;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2011 IEEE International Conference on

Conference_Location

Kaohsiung

Print_ISBN

978-1-61284-775-7

Type

conf

DOI

10.1109/NEMS.2011.6017560

Filename

6017560