Analytical Modelling for Adaptive Multi-Purpose On-Chip Optical Interconnect

Due to their high bandwidth, high interconnection density and superior performance, optical interconnects have been recognized as a potential means for increasing performance and driving out the problems associated with on-chip metallic interconnects. Coupled with advances in semiconductor technology that will enable manufacturers to meet the demand for the integration of optical and electronic components on a single Integrated Circuit (IC), optical interconnects, contrary to their conventional use, may perform multifunctional tasks. The work in this paper is directed toward developing analytical modelling expressions that determine how an optical interconnect could adapt itself to performing multi-tasks, with conflicting requirements, simultaneously.