• DocumentCode
    3285
  • Title

    AlGaN/GaN HEMT Degradation: An Electro-Thermo-Mechanical Simulation

  • Author

    der Maur, Matthias Auf ; Di Carlo, A.

  • Author_Institution
    Dept. of Electron. Eng., Univ. of Rome Tor Vergata, Rome, Italy
  • Volume
    60
  • Issue
    10
  • fYear
    2013
  • fDate
    Oct. 2013
  • Firstpage
    3142
  • Lastpage
    3148
  • Abstract
    We present fully self-consistent simulation results based on an electro-thermo-mechanical model of a typical AlGaN/GaN HEMT structure. The mechanical stress state is analyzed under different dc operating conditions in view of possible dislocation formation and movement by comparing simulated elastic energy densities and resolved shear stresses with theoretically predicted values. In particular, we find nonzero resolved shear stress on all wurtzite slip systems, with relevant values especially at high dc power. This could allow formation and movement of dislocations, leading to device degradation.
  • Keywords
    III-V semiconductors; aluminium compounds; dislocations; gallium compounds; high electron mobility transistors; internal stresses; semiconductor device models; wide band gap semiconductors; AlGaN-GaN; HEMT degradation; device degradation; dislocation formation; elastic energy density; electro-thermo-mechanical model; high electron mobility transistors; mechanical stress state; nonzero resolved shear stress; wurtzite slip systems; Defects; HEMT; device simulation; dislocation glide; nitrides; strain;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2267547
  • Filename
    6544581