DocumentCode
3285
Title
AlGaN/GaN HEMT Degradation: An Electro-Thermo-Mechanical Simulation
Author
der Maur, Matthias Auf ; Di Carlo, A.
Author_Institution
Dept. of Electron. Eng., Univ. of Rome Tor Vergata, Rome, Italy
Volume
60
Issue
10
fYear
2013
fDate
Oct. 2013
Firstpage
3142
Lastpage
3148
Abstract
We present fully self-consistent simulation results based on an electro-thermo-mechanical model of a typical AlGaN/GaN HEMT structure. The mechanical stress state is analyzed under different dc operating conditions in view of possible dislocation formation and movement by comparing simulated elastic energy densities and resolved shear stresses with theoretically predicted values. In particular, we find nonzero resolved shear stress on all wurtzite slip systems, with relevant values especially at high dc power. This could allow formation and movement of dislocations, leading to device degradation.
Keywords
III-V semiconductors; aluminium compounds; dislocations; gallium compounds; high electron mobility transistors; internal stresses; semiconductor device models; wide band gap semiconductors; AlGaN-GaN; HEMT degradation; device degradation; dislocation formation; elastic energy density; electro-thermo-mechanical model; high electron mobility transistors; mechanical stress state; nonzero resolved shear stress; wurtzite slip systems; Defects; HEMT; device simulation; dislocation glide; nitrides; strain;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2267547
Filename
6544581
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