Title :
Standardised packaging and interconnection for inter and intra-board optical communication (SPIBOC)
Author_Institution :
Nortel Technol., Harlow, UK
Abstract :
The European ESPRIT III SPIBOC project has developed a small set of cost-effective modules and interconnect media for building very high performance optical links. These links will support 12 channels at up to 2.5 Gbit/s per channel.
Keywords :
integrated circuit packaging; integrated optoelectronics; modules; optical fibre communication; optical interconnections; research initiatives; standardisation; 2.5 Gbit/s; European ESPRIT III SPIBOC project; Gbit/s per channel; cost-effective modules; inter-board optical communication; interconnect media; intra-board optical communication; optical interconnections; standardised packaging; very high performance optical links;
Conference_Titel :
Optical Communication, 1996. ECOC '96. 22nd European Conference on
Conference_Location :
Oslo, Norway
Print_ISBN :
82-423-0418-1
