• DocumentCode
    3285354
  • Title

    A new consideration of correlation between external noise sources in HEMT two-temperature model

  • Author

    Saghafi, Sahar ; Arfaei, Foad

  • Author_Institution
    Electr. Eng. Dept., Amirkabir Univ. of Technol., Tehran, Iran
  • fYear
    2003
  • fDate
    15-17 Oct. 2003
  • Firstpage
    14
  • Lastpage
    15
  • Abstract
    We consider the correlation between equivalent gate and drain noise sources in the two-temperature model to demonstrate a better compatibility between measured noise parameters (yopt, Rn , Fmin) and the results from simulation. The originality of the contribution lies in considering correlation between external input and output equivalent noise temperatures ( Tin and Tout) for a transistor. Danneville´s model has been used with two additional constants (real and imaginary parts of correlation) which has a better agreement with measurements. A two stage MMIC compatible HEMT low noise amplifier at Ka-band, which could be used for local multipoint distribution systems (LMDS) and fixed satellite services (FSS), has been designed and the effect on its noise figure of noise sources´ correlation has been considered. A low noise amplifier in Ka-band has been designed, and the proposed model applied to it. The results of the simulation have been compared in three cases.
  • Keywords
    HEMT integrated circuits; MMIC; circuit noise; high electron mobility transistors; integrated circuit design; microwave amplifiers; millimetre wave amplifiers; semiconductor device models; semiconductor device noise; thermal noise; Danneville model; HEMT low noise amplifier; HEMT two-temperature model; Ka-band; LMDS; MMIC compatible amplifier; drain noise source; equivalent noise temperatures; external noise sources; fixed satellite services; gate noise source; noise parameters; noise source correlation; Distributed amplifiers; Frequency selective surfaces; HEMTs; Low-noise amplifiers; MMICs; Noise figure; Noise measurement; Optimized production technology; Satellites; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Communication Technology, 2003. IEEE Topical Conference on
  • Print_ISBN
    0-7803-8196-3
  • Type

    conf

  • DOI
    10.1109/WCT.2003.1321422
  • Filename
    1321422