Title :
Analysis of crosstalk in packaged microwave circuits
Author :
Chien-Nan Kuo ; Houshmand, B. ; Itoh, Takayuki
Author_Institution :
Dept. of Electr. Eng., California Univ., Los Angeles, CA
Abstract :
Crosstalk in a packaged multi-circuit system is simulated by applying the FDTD method using large-signal analysis. The capability of full-wave simulation is obtained by appropriate modeling of the device-wave interaction. Crosstalk of different input-power levels, thus, is examined by checking the output power
Keywords :
crosstalk; equivalent circuits; finite difference time-domain analysis; microwave circuits; packaging; FDTD method; crosstalk; device-wave interaction modelling; full-wave simulation; large-signal analysis; output power; packaged microwave circuits;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564827
