Title :
Time domain modeling of high-speed circuit structures with TLM
Author :
Hoefer, Wolfgang J. R.
Author_Institution :
Victoria Univ., BC
Abstract :
This paper describes two important new features necessary for the efficient modeling of transient electromagnetic signals in high-speed circuit structures using the time domain Transmission Line Matrix (TLM) method of analysis. These are the accurate representation of fields in the vicinity of sharp edges, and the modeling of packages using a hybrid TLM/Mode Matching approach in the transient regime
Keywords :
digital circuits; microwave circuits; mode matching; packaging; time-domain analysis; transient analysis; transmission line matrix methods; TLM method; high-speed circuit structures; hybrid TLM/mode matching approach; packages; time domain modeling; transient EM signal modelling; transient electromagnetic signals;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564828
