Title :
Microwave circuit modeling of an elevated paddle surface mount package
Author :
Jackson, Robert W. ; Rakshit, Subrata
Author_Institution :
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA
Abstract :
This paper describes a circuit model which properly accounts for ground pin location effects in plastic surface mount packages such as the SSOP-24. The model is validated by comparison to measurements of scaled models and to full wave simulations
Keywords :
MMIC; integrated circuit modelling; integrated circuit packaging; plastic packaging; surface mount technology; MMIC package; SMD; SSOP-24; elevated paddle surface mount package; ground pin location effects; microwave circuit modeling; plastic surface mount packages;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564829
