DocumentCode
3286053
Title
A GaAs MMIC-based inline RF MEMS power sensor
Author
Zhang, Zhiqiang ; Liao, Xiaoping ; Han, Lei ; Su, Shi
Author_Institution
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
fYear
2009
fDate
25-28 Oct. 2009
Firstpage
1705
Lastpage
1708
Abstract
In order to improve microwave characteristics and the frequency response of the output thermovoltage at X-band, an inline RF MEMS power sensor with the impedance matching and compensating capacitance structures is presented in the paper and the sensor is accomplished with GaAs MMIC process. The measured results show that the reflection loss of the sensor is less than -17 dB and the insertion loss is less than 0.8 dB at X-band. A sensitivity of more than 26 ¿V·mW-1 and a resolution of 0.316 mW are obtained at 10 GHz. The frequency response of the sensor is relatively flat, and the modulation depth under amplitude modulation (AM) signals influences the output directly. The measured mechanical resonant frequency (fo) of the MEMS membrane is 110 kHz. In addition, the measured results show that the intermodulation (IM) power for ¿f = 80 kHz, P1 = P2 = 10 dBm of the signals is less than -52 dBm. And the input third-order intermodulation intercept point (IIP3) is a large value at ¿f = fo, so the inline RF MEMS power sensor for ¿f ¿ fo will not generate significant intermodulation distortion.
Keywords
III-V semiconductors; MMIC; amplitude modulation; gallium arsenide; intermodulation distortion; microsensors; microwave detectors; power measurement; GaAs; MEMS membrane; MMIC-based inline RF MEMS; amplitude modulation signals; frequency 10 GHz; frequency response; impedance matching; inline RF MEMS power sensor; intermodulation distortion; intermodulation power; mechanical resonant frequency; microwave characteristics; reflection loss; thermovoltage; third-order intermodulation intercept point; Amplitude modulation; Capacitance; Capacitive sensors; Frequency response; Gallium arsenide; Impedance matching; Microwave sensors; Radiofrequency microelectromechanical systems; Sensor phenomena and characterization; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2009 IEEE
Conference_Location
Christchurch
ISSN
1930-0395
Print_ISBN
978-1-4244-4548-6
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2009.5398504
Filename
5398504
Link To Document