Title :
High performance flip-chip technique for wide-band modules
Author :
Iwasaki, Naoki ; Ishitsuka, F. ; Kato, Toshihiko
Author_Institution :
NTT Interdisciplinary Res. Labs., Tokyo
Abstract :
A novel wide-band flip-chip technique is proposed, where optimized wide-gap coplanar waveguides are used to reduce the discontinuity. The flip-chip technique made it possible to achieve the return loss of over 28 dB up to 80 GHz
Keywords :
MIMIC; MMIC; coplanar waveguides; flip-chip devices; hybrid integrated circuits; integrated circuit packaging; microassembling; modules; 28 dB; 60 GHz; EHF; SHF; high performance flip-chip technique; micro-bumps; return loss; wide-band modules; wide-gap CPW; wide-gap coplanar waveguides; wideband flip-chip technique;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564832
