Title :
A method of providing grounding for a microwave multilayer MMIC package
Author :
Lindner, Andreas
Author_Institution :
StratEdge Corp., San Diego, CA
Abstract :
A microwave multilayer MMIC package with DC traces and transmission line ground on the same layer is presented. This paper illustrates a technique for proper implementation of grounding and the minimizing of the effects of buried DC lines on the electrical performance of transmission lines
Keywords :
MMIC; earthing; integrated circuit packaging; microstrip lines; DC traces; MMIC package; microwave multilayer package; transmission line ground;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564833
