DocumentCode
3286074
Title
A method of providing grounding for a microwave multilayer MMIC package
Author
Lindner, Andreas
Author_Institution
StratEdge Corp., San Diego, CA
fYear
1996
fDate
28-30 Oct 1996
Firstpage
210
Lastpage
212
Abstract
A microwave multilayer MMIC package with DC traces and transmission line ground on the same layer is presented. This paper illustrates a technique for proper implementation of grounding and the minimizing of the effects of buried DC lines on the electrical performance of transmission lines
Keywords
MMIC; earthing; integrated circuit packaging; microstrip lines; DC traces; MMIC package; microwave multilayer package; transmission line ground;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564833
Filename
564833
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