DocumentCode
3286085
Title
The board implementation for checking SEU test on memory devices
Author
Lho, Young Hwan ; Kim, Ki Yup
Author_Institution
Sch. of Comput., Electron. & Commun. Eng., Woosong Univ., Daejon, South Korea
Volume
2
fYear
2004
fDate
18-21 Oct. 2004
Firstpage
843
Abstract
The major problem encountered in nuclear plant and space applications is EMI (electro-magnetic interference) and EMC (electro-magnetic compatibility). Here, our locus is to implement the test board for SEU (single event upset) of checking the effects of protons on the electronic system. The SEU results from the level change of stored information due to photon radiation and temperature in the space environment. The impact of SEU on PLD (programmable logic devices) technology is most apparent in ROM/SRAM/DRAM devices wherein the state of storage cell can be upset. In this paper, a simple and powerful test techniques is suggested, and the results are presented for the analysis and future reference. In our experiment, the proton radiation facility (50 MeV with a beam current of 60 μA of cyclotron) available at KIRAMS (Korea Institute of Radiological Medical Sciences) has been applied on commercial grade SRAM and EPROM manufactured by Hynix Semiconductor Company.
Keywords
DRAM chips; SRAM chips; electromagnetic compatibility; electromagnetic interference; integrated circuit testing; programmable logic devices; read-only storage; semiconductor device testing; 50 MeV; 60 muA; DRAM device; Korea Institute of Radiological Medical Sciences; ROM device; SRAM device; board implementation; electromagnetic compatibility; electromagnetic interference; electronic system; memory devices; nuclear plant; photon radiation; photon temperature; programmable logic devices; proton effect; proton radiation facility; single event upset; space applications; storage cell; Electromagnetic compatibility; Electromagnetic interference; Electronic equipment testing; Programmable logic devices; Protons; Random access memory; Single event upset; Space technology; System testing; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN
0-7803-8511-X
Type
conf
DOI
10.1109/ICSICT.2004.1436639
Filename
1436639
Link To Document