DocumentCode
3286093
Title
Performance of 3-D microwave package for X-band radar
Author
Wooldridge, J.J.
Author_Institution
Hughes Aircraft Co., Los Angeles, CA
fYear
1996
fDate
28-30 Oct 1996
Firstpage
213
Lastpage
214
Abstract
A 3-D package for X-band active phase arrays was developed in order to provide higher density packaging that resulted in reduced weight, depth, and cost of an active array radar
Keywords
active antenna arrays; antenna accessories; microwave circuits; packaging; phased array radar; radar equipment; 3D microwave package; T/R modules; X-band radar; active array radar; active phase arrays; transmit/receive modules;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location
Napa, CA
Print_ISBN
0-7803-3514-7
Type
conf
DOI
10.1109/EPEP.1996.564834
Filename
564834
Link To Document