Title :
Performance of 3-D microwave package for X-band radar
Author :
Wooldridge, J.J.
Author_Institution :
Hughes Aircraft Co., Los Angeles, CA
Abstract :
A 3-D package for X-band active phase arrays was developed in order to provide higher density packaging that resulted in reduced weight, depth, and cost of an active array radar
Keywords :
active antenna arrays; antenna accessories; microwave circuits; packaging; phased array radar; radar equipment; 3D microwave package; T/R modules; X-band radar; active array radar; active phase arrays; transmit/receive modules;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
DOI :
10.1109/EPEP.1996.564834
