DocumentCode :
3286157
Title :
Modeling of MEMS reliability in shock environments
Author :
Fang, Xu-Wen ; Huang, Qing-An ; Tang, Jie-ying
Author_Institution :
Minist. of Educ. Key Lab. of MEMS, Southeast Univ., Nanjing, China
Volume :
2
fYear :
2004
fDate :
18-21 Oct. 2004
Firstpage :
860
Abstract :
To determine the reliability of MEMS devices in shock environments, in this paper, we present a method that can be used to formulate the responses of microcantilever under shock loads by taking it as a distributed-parameter system. The displacements and stresses of microcantilever are formulated with the mode superposition method. The failure modes may be estimated by the maximum displacement and stress. This method can be also used in other complicated MEMS structures and devices, therefore the reliability designs of MEMS can be improved greatly.
Keywords :
micromechanical devices; reliability; MEMS reliability; distributed-parameter system; failure modes; microcantilever displacement; microeantilever stress; mode superposition method; shock environments; Commercialization; Electric shock; Fabrication; Microelectromechanical devices; Micromechanical devices; Microstructure; Packaging; Predictive models; Reliability engineering; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
Type :
conf
DOI :
10.1109/ICSICT.2004.1436643
Filename :
1436643
Link To Document :
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