DocumentCode :
3286187
Title :
Modeling ground plane cuts using transmission line theory
Author :
Tuncer, Enis ; Yuan, F.Y.
Author_Institution :
Quad Design Technol., Camarillo, CA
fYear :
1996
fDate :
28-30 Oct 1996
Firstpage :
229
Lastpage :
231
Abstract :
In terms of signal integrity in complex digital and mixed signal PCBs, the effects of ground cuts and split planes has to be analyzed accurately. In this work ground cuts and split planes are modeled using transmission line approach, and results are presented compared to FDTD calculations and measurements
Keywords :
finite difference time-domain analysis; packaging; printed circuit design; transmission line theory; FDTD calculations; digital PCBs; ground plane cuts; mixed signal PCBs; signal integrity; split planes; transmission line theory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting
Conference_Location :
Napa, CA
Print_ISBN :
0-7803-3514-7
Type :
conf
DOI :
10.1109/EPEP.1996.564840
Filename :
564840
Link To Document :
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