DocumentCode
3287095
Title
A new electrothermal technology based on LIEP method
Author
Qi, Weimin ; Ji, Xiaowei
Author_Institution
Sch. of Phys. & Inf. Eng., Jianghan Univ., Wuhan, China
fYear
2011
fDate
15-17 April 2011
Firstpage
1051
Lastpage
1054
Abstract
Laser Induced Electroless Plating(LIEP) has many advantages such as relatively low cost, homogeneous microstructure, feasibility to be applied on non-metal substrates and operated at room temperature with relative simple equipment, and thus became a hot research topic in flexible circuit making. But the wide application of LIEP has still some defects, such as poor accuracy, low speed and low repeatability brought by the concentration, temperature, thickness of plating solution. An improved algorithm is proposed in this paper aiming at enhancing the Laser Induced Electroless plating on the fabric utilizing the AC electrothermal technology. A mathematical model is also established and the simulation has been done. The results show that it is not only effective and feasible, but also capable of minimizing the pollution greatly, and thus of great convenience for future micro electro mechanical systems and its microfabrication.
Keywords
micromechanical devices; substrates; AC electrothermal technology; flexible circuit making; laser induced electroless plating; micro electro mechanical systems; microfabrication; nonmetal substrates; Electric fields; Electrodes; Equations; Fluids; Mathematical model; Substrates; Laser Induced Electroless Plating(LIEP); electrothermal technology; flexible circuit; microfabrication;
fLanguage
English
Publisher
ieee
Conference_Titel
Electric Information and Control Engineering (ICEICE), 2011 International Conference on
Conference_Location
Wuhan
Print_ISBN
978-1-4244-8036-4
Type
conf
DOI
10.1109/ICEICE.2011.5777962
Filename
5777962
Link To Document