• DocumentCode
    3287095
  • Title

    A new electrothermal technology based on LIEP method

  • Author

    Qi, Weimin ; Ji, Xiaowei

  • Author_Institution
    Sch. of Phys. & Inf. Eng., Jianghan Univ., Wuhan, China
  • fYear
    2011
  • fDate
    15-17 April 2011
  • Firstpage
    1051
  • Lastpage
    1054
  • Abstract
    Laser Induced Electroless Plating(LIEP) has many advantages such as relatively low cost, homogeneous microstructure, feasibility to be applied on non-metal substrates and operated at room temperature with relative simple equipment, and thus became a hot research topic in flexible circuit making. But the wide application of LIEP has still some defects, such as poor accuracy, low speed and low repeatability brought by the concentration, temperature, thickness of plating solution. An improved algorithm is proposed in this paper aiming at enhancing the Laser Induced Electroless plating on the fabric utilizing the AC electrothermal technology. A mathematical model is also established and the simulation has been done. The results show that it is not only effective and feasible, but also capable of minimizing the pollution greatly, and thus of great convenience for future micro electro mechanical systems and its microfabrication.
  • Keywords
    micromechanical devices; substrates; AC electrothermal technology; flexible circuit making; laser induced electroless plating; micro electro mechanical systems; microfabrication; nonmetal substrates; Electric fields; Electrodes; Equations; Fluids; Mathematical model; Substrates; Laser Induced Electroless Plating(LIEP); electrothermal technology; flexible circuit; microfabrication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electric Information and Control Engineering (ICEICE), 2011 International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4244-8036-4
  • Type

    conf

  • DOI
    10.1109/ICEICE.2011.5777962
  • Filename
    5777962