Framework for co-simulation of signal and power integrity in server systems

Author

Winkel, T. ; Harrer, Hubert ; Strach, Thomas ; Rimolo-Donadio, Renato ; Kwark, Y. ; Xiaomin Duan ; Schuster, Christian

Author_Institution

R&D, IBM Germany, Boeblingen, Germany

fYear

2012

fDate

21-24 Oct. 2012

Firstpage

21

Lastpage

24

Abstract

Considerations for comprehensive simulation and analysis of high-speed links in complex server systems are discussed in this work. A framework that considers the interactions between multiple signals and the power distribution network is described. In the last section, the nature of the interactions between power and signal domains is analyzed by means of a simplified scenario at board level.

Keywords

circuit simulation; high-speed integrated circuits; integrated circuit interconnections; complex server system; high-speed link; interconnects; multiple signals; power distribution network; power domain; power integrity; signal cosimulation; signal domain; signal integrity; Couplings; Integrated circuit modeling; Noise; Numerical models; Packaging; Scattering parameters; high-speed links; interconnects; power integrity; server systems; signal integrity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on

Conference_Location

Tempe, AZ

Print_ISBN

978-1-4673-2539-4

Electronic_ISBN

978-1-4673-2537-0

Type

conf

DOI

10.1109/EPEPS.2012.6457834

Filename

6457834