• DocumentCode
    3287644
  • Title

    An improved methodology for analysis of s-parameter measurements on substrate crosstalk test structures

  • Author

    Li, Jing ; Li, Weiying ; Wang, Richard ; Wei, Linpeng ; Yang, Jian ; Zhao, Hongwei

  • Author_Institution
    Circuit CAE, Freescale Semicond. Ltd., Beijing, China
  • Volume
    2
  • fYear
    2004
  • fDate
    18-21 Oct. 2004
  • Firstpage
    1155
  • Abstract
    Although isolated P-wells (IPW) can provide a high degree of immunity from substrate noise in mixed-signal circuits, their superior characteristics makes it extremely difficult to measure their isolation properties using the traditional approach of s-parameter measurements on 2-port rf test structures configured in a ground-signal-ground (GSG) pattern. It has been proven that measurement results obtained from such test structures are dominated by parasitic coupling between metal interconnect layers and the substrate, while the amount of noise that is actually coupled through the IPW region into the Si substrate is substantially smaller. In this report a new technique for separating the intrinsic isolation characteristics of IPW regions from parasitic coupling effects is presented. The commonly used 2-port test structure is treated internally as 3-port system which can be fully represented by a nine element y-parameters matrix. These nine elements can be obtained using two additional structures which are simple variations of the traditionally used test structure. This new approach has been verified by comparison with 3D TCAD simulations which were calibrated to measured Si data.
  • Keywords
    S-parameters; circuit CAD; coupled circuits; crosstalk; integrated circuit interconnections; mixed analogue-digital integrated circuits; substrates; 2-port RF test structures; 3D TCAD simulation; Si; ground-signal-ground pattern; isolated P-wells; metal interconnect layer; mixed-signal circuits; parasitic coupling; s-parameter measurement; substrate crosstalk test structures; Ambient intelligence; Crosstalk; Dielectric substrates; Equations; Intelligent networks; Isolation technology; Matrix converters; P-n junctions; Scattering parameters; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
  • Print_ISBN
    0-7803-8511-X
  • Type

    conf

  • DOI
    10.1109/ICSICT.2004.1436727
  • Filename
    1436727