Title :
Minimizing displacement return currents in multilayer via structures
Author :
Hardock, Andreas ; Muller, Sebastian ; Xiaomin Duan ; Bruns, H. ; Schuster, Christian
Author_Institution :
Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg-Harburg, Hamburg, Germany
Abstract :
A fast approach for the calculation of ground via return currents using the contour integral method is presented. From the analysis of the displacement currents design rules for optimized vias in multilayered boards are derived.
Keywords :
printed circuits; contour integral method; displacement return current minimization design; ground via return currents; multilayer via structures; multilayered boards; printed circuit board; Apertures; Cavity resonators; Crosstalk; Electromagnetic compatibility; Impedance; Ports (Computers); Reflection; printed circuit board; return current; via;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-2539-4
Electronic_ISBN :
978-1-4673-2537-0
DOI :
10.1109/EPEPS.2012.6457878
