Title :
Parametric study of heat transfer enhancement using nanofluids
Author :
Ding, Z.W. ; Cheah, S.C. ; Saeid, Nawaf H.
Author_Institution :
Dept of Mech., Univ. of Nottingham, Semenyih, Malaysia
Abstract :
This paper provides a brief insight into the advantages of utilizing nanofluids (nano-sized particles in fluid) in replacement of conventional coolant materials. Nanofluids have been recognized as an alternative coolant material due to the heat transfer enhancement thus reducing the required coolant power. This paper presents numerical simulations of convective heat transfer under laminar flow conditions. The parametric study has been carried out and the results are presented for both heat transfer coefficient and wall shear stress with the introduction of titanium-oxide (TiO2) nanoparticle of volume fraction 0% to 10% into a solution of pure water. The study also presents the results to show the effect of increasing nanoparticle volume fraction on wall shear stress. It is found that both the heat transfer coefficient and the wall shear stress increases with the increase of the volume fraction of nanoparticles.
Keywords :
computational fluid dynamics; convection; coolants; flow simulation; laminar flow; nanofluidics; nanoparticles; numerical analysis; pipe flow; shear flow; titanium compounds; two-phase flow; water; H2O; TiO2; aqueous solution; convective heat transfer; coolant material; heat transfer coefficient; heat transfer enhancement; laminar flow; nanofluids; nanoparticle volume fraction; numerical simulations; parametric study; titanium-oxide nanoparticle; wall shear stress; Coolants; Cooling; Equations; Heat transfer; Nanoparticles; Parametric study; Thermal conductivity; Thermal stresses; Titanium; Viscosity; Effective thermal conductivity; Friction loss; Heat transfer; Nanofluids; Titanium oxide;
Conference_Titel :
Energy and Environment, 2009. ICEE 2009. 3rd International Conference on
Conference_Location :
Malacca
Print_ISBN :
978-1-4244-5144-9
Electronic_ISBN :
978-1-4244-5145-6
DOI :
10.1109/ICEENVIRON.2009.5398632