DocumentCode :
3288502
Title :
An implementation of interleaved microstrip motherboard routing in Multi-Gbps I/O channel margin improvement
Author :
Yih Jye Tan ; Heck, H. ; Kong, Jackson ; Wei Jern Tan
Author_Institution :
PC Client Group, Intel Corp., Kulim, Malaysia
fYear :
2012
fDate :
21-24 Oct. 2012
Firstpage :
299
Lastpage :
302
Abstract :
This paper presents an interleaved routing method for motherboard microstrip routing in Multi-Gbps interfaces. The proposed method yields improved channel performance in terms of Eye Height(mV) and Eye Width(ps) margins. Of note is the more prominent improvement in topologies with longer transmission lines. This method enables greater routing flexibility using full microstrip transmission lines with the benefit of improved channel margins at 20 mils inter-pair spacing. More importantly, it allows for the more tightly spaced 15 mils interpair spacing to be utilized without jeopardizing overall channel margins. Ultimately, this translates into a cost saving benefit in line with recent platforms´ sleek and thin form factor.
Keywords :
microstrip lines; network routing; transmission lines; eye height margin; eye width margin; full microstrip transmission lines; interleaved microstrip motherboard routing method; interpair spacing; multiGbps I/O channel margin improvement; thin form factor; transmission lines; Couplings; Crosstalk; Microstrip; Power transmission lines; Receivers; Routing; Topology; Far-End Crosstalk; channel margin improvement; interleaved motherboard main-route; multi-Gbps interfaces;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
Conference_Location :
Tempe, AZ
Print_ISBN :
978-1-4673-2539-4
Electronic_ISBN :
978-1-4673-2537-0
Type :
conf
DOI :
10.1109/EPEPS.2012.6457901
Filename :
6457901
Link To Document :
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