Title :
PPF(pre-plated frame) technology using Sn-Bi and pure Sn electro deposition on alloy 42 lead frame for semiconductor package corresponding to lead-free movement
Author :
Kim, J.-D. ; Choi, W.-S. ; Park, K.-S. ; Kim, E.-H. ; Lee, S.-B. ; Kim, H.-G.
Author_Institution :
Semicond. Material R&D Center, Samsung Techwin Co., Ltd., Kyoungki, South Korea
Abstract :
There are many lead-free finish options such as pure Sn, Sn-Ag, Sn-Bi and Sn-Cu post-mold plating and Pd pre-plating for the lead frame plating in semiconductor package. In the present work, Sn-Bi and pure Sn pre-plating technology for alloy 42 lead frame have been performed. The electrodeposition was done by two-tone selective plating method. Ag was plated on external lead, respectively. Surface and cross-sectional morphology were observed by SEM, and solderability/bending crack/whisker performance after temperature cycles have been performed.
Keywords :
electroplating; scanning electron microscopy; semiconductor device packaging; surface morphology; tin alloys; PPF technology; Pd; Pd pre-plating; SEM; Sn-Ag; Sn-Bi; Sn-Cu; alloy 42 lead frame; bending performance; crack performance; cross-sectional morphology; electrodeposition; lead frame plating; lead-free movement; post-mold plating; pre-plated frame technology; semiconductor package; solderability performance; surface morphology; temperature cycling; two-tone selective plating; whisker performance; Current density; Environmentally friendly manufacturing techniques; Lead compounds; Optical microscopy; Scanning electron microscopy; Semiconductor device packaging; Surface cracks; Temperature; Testing; Tin;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
Print_ISBN :
0-7803-8582-9
DOI :
10.1109/IEMT.2004.1321630
