DocumentCode
3288927
Title
The socket response to current packaging and test trends
Author
Andes, Jamie ; Bogatin, Eric
Author_Institution
Synergetix, USA
fYear
2004
fDate
July 14-16, 2004
Firstpage
97
Lastpage
99
Abstract
Denser, faster, cheaper are still the driving forces for semiconductor packages. Not only must the assembly infrastructure keep up, but the test infrastructure must evolve to meet the challenging needs of the packages. This means pitches at 0.4 mm and tighter bandwidths greater than 5 GHz, quick turn times, and reduced total cost of ownership.
Keywords
probes; semiconductor device packaging; semiconductor device testing; assembly infrastructure; design for manufacture; high bandwidth applications; semiconductor device testing; semiconductor packages; socket response; spring contact probes; test infrastructure; test sockets; Assembly; Bandwidth; Coaxial cables; Manufacturing; Pins; Probes; Semiconductor device packaging; Sockets; Springs; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
ISSN
1089-8190
Print_ISBN
0-7803-8582-9
Type
conf
DOI
10.1109/IEMT.2004.1321639
Filename
1321639
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