Title :
A new approach to chemical analysis of packaging/assembly materials: SARIS™ laser ablation ICP mass spectrometry
Author :
Li, Fuhe ; Anderson, Scott
Author_Institution :
Balazs Anal. Services, Air Liquide, Fremont, CA, USA
Abstract :
Our recent studies with laser ablation ICP mass spectrometry (LA ICP-MS) have been focused specifically on the development of this technique for practical analysis of packaging/assembly materials involved in back-end manufacturing processes where elemental composition, element ratios, and trace metallic contamination are of critical importance. In this paper we will describe the advantages of the LA ICP-MS technique, and applications where LA ICP-MS can be used to analyze conductive, semiconductive and insulating materials without any sample pre-treatment, applications have included bonding wires, solder bumps, lead frames, polymer materials, adhesives and final packages. Environmentally sensitive contaminants such as cadmium, chromium, lead, mercury, and tin are shown to be easily analyzed from any solid materials. Finally, the complementary aspects of LA ICP-MS versus alternative techniques such as SEM-EDX and X-ray fluorescence (XRF) for back-end manufacturing processing are also discussed.
Keywords :
laser ablation; mass spectrometers; mass spectroscopic chemical analysis; materials properties; microassembling; semiconductor device packaging; ICP mass spectrometry; SARIS™; SEM-EDX; X-ray fluorescence; adhesives; assembly materials; bond wires; cadmium; chemical analysis; chromium; conductive materials; contaminants; element ratios; elemental composition; insulating materials; laser ablation; lead frames; manufacturing processes; mercury; metallic contamination; packaging materials; polymer materials; semiconductive materials; solder bumps; solid materials; tin; Assembly; Chemical analysis; Chemical lasers; Conducting materials; Laser ablation; Manufacturing processes; Mass spectroscopy; Optical materials; Semiconductor device packaging; Semiconductor materials;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
Print_ISBN :
0-7803-8582-9
DOI :
10.1109/IEMT.2004.1321648