DocumentCode :
3289153
Title :
Research and Application of Intelligent Building System Integration Methods
Author :
Wei, Su ; Lijun, Xue ; Ying, Liu
Author_Institution :
Autom. Coll., Beijing Union Univ., Beijing, China
fYear :
2009
fDate :
16-17 May 2009
Firstpage :
273
Lastpage :
276
Abstract :
This paper explains the different layers of integration in intelligent building system and analyses characteristics and problems of four existing integration modules. Two new solutions of parallel integration module and OPC componential integration module are presented. The core idea of parallel integration module is that BMS network is divided into management network and monitor network with its subsystems running in monitoring network and system integration database running in management network. The integration of each subsystem and management network can be divided into two types according to the additional application program. The first one is to realize integration through industrial standard protocol. Another one is to develop gateway software by using application program of API/Net API function provided by system to ensure access to database when both communication sides do not have one standard protocol interface. The core idea of OPC componential integration module is to develop an OPC server running between central monitoring and control station of BMS and each subsystem to ensure the same standard OPC being used by OPC server and OPC client and direct intercommunication.
Keywords :
application program interfaces; building management systems; home automation; API function; gateway software; industrial standard protocol; intelligent building system integration research methods; parallel integration module; system integration database; Access protocols; Application software; Communication standards; Communication system software; Databases; Intelligent structures; Intelligent systems; Monitoring; Software standards; Standards development; API; OPC; integration module; software gateway;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits, Communications and Systems, 2009. PACCS '09. Pacific-Asia Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-0-7695-3614-9
Type :
conf
DOI :
10.1109/PACCS.2009.100
Filename :
5232339
Link To Document :
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