DocumentCode :
3289170
Title :
Peculiarities of measuring the alpha particle activity of flat samples of metals, alloys and powders using gas flow proportional counters specifically the model 1950 manufactured by "Spectrum Sciences", USA
Author :
Zakharyasah, S.M. ; Tolstukhin, Y.B. ; Fedotova, I.V.
Author_Institution :
Pure Technol., LLC, Atlanta, GA, USA
fYear :
2004
fDate :
July 14-16, 2004
Firstpage :
152
Lastpage :
157
Abstract :
Naturally occurring radioactive emissions from solder (Pb/Sn or Pb-free) in semiconductor devices may result in memory device malfunctions and possible consequential product liability. These "soft errors" occur randomly but do not cause permanent physical damage to the memory cell. The principal product developed to reduce the probability of soft error malfunctions in memory devices is low alpha lead/tin alloys and low alpha lead-free alloys. As standards for determining alpha emitter emissions have not been adopted by the Semiconductor industry, proposed for discussion are actual testing methods and standards of measurement. Of interest, and the subject of this research is the description(s) of testing procedures and measurement techniques for accurate surface alpha emission counts from flat metal and alloy material, metal alloy powders, tin and lead oxide powders. These materials are used, principally, in solder paste, solder spheres, electroplating anodes, and plating chemistry. Discussion is focused on test equipment, sample preparation, alpha counting techniques and the accuracy of alpha emission measurements.
Keywords :
alloys; alpha-particle detection; alpha-particle effects; alpha-particle sources; ion emission; lead; powders; semiconductor devices; solders; tin; Pb-Sn; alloy material; alpha counting techniques; alpha emitter emissions; alpha particle activity; electroplating anodes; flat metal; gas flow; lead oxide powders; low alpha lead-free alloys; low alpha lead-tin alloys; measurement standards; memory cell; memory device malfunctions; memory devices; metal alloy powders; metals; permanent physical damage; plating chemistry; product liability; radioactive emissions; sample preparation; semiconductor devices; semiconductor industry; soft errors; solder paste; solder spheres; spectrum sciences; test equipment; testing methods; tin powders; Alpha particles; Counting circuits; Environmentally friendly manufacturing techniques; Fluid flow; Lead; Measurement standards; Particle measurements; Powders; Tin alloys; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
ISSN :
1089-8190
Print_ISBN :
0-7803-8582-9
Type :
conf
DOI :
10.1109/IEMT.2004.1321650
Filename :
1321650
Link To Document :
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