Guidelines for improving intermetallic reliability

Author

Levine, Lee, Sr. ; Osborne, Matt ; Keller, Frank

Author_Institution

Adv. Packaging, Kulicke & Soffa Ind. Inc., Willow Grove, PA, USA

fYear

2004

fDate

July 14-16, 2004

Firstpage

174

Lastpage

176

Abstract

As wire bonding continues to advance, new challenges are resolved. In ultra-fine pitch bonding (<50μm pitch), efforts to maximize wire diameter have resulted in specialized contained inner chamfer (CIC) capillaries, that reduce friction between the wire and feed hole, allowing the use of larger diameter wire without feed and interference problems. New wires have been developed that provide significantly improved intermetallic reliability after thermal aging of small diameter ball bonds. Bonders with improved z-axis control provide greater control of impact forces for improved intermetallic formation and coverage.

Keywords

fine-pitch technology; integrated circuit bonding; integrated circuit interconnections; integrated circuit reliability; ball bonds; contained inner chamfer capillaries; feed problems; impact forces control; improved z-axis control; interference problems; intermetallic coverage; intermetallic formation; intermetallic reliability improvements; reduced friction; thermal aging; ultra-fine pitch bonding; wire bonding; wire diameter maximization; Aluminum; Bonding; Feeds; Frequency; Friction; Guidelines; Intermetallic; Packaging; Robustness; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International

ISSN

1089-8190

Print_ISBN

0-7803-8582-9

Type

conf

DOI

10.1109/IEMT.2004.1321655

Filename

1321655