Title :
Guidelines for improving intermetallic reliability
Author :
Levine, Lee, Sr. ; Osborne, Matt ; Keller, Frank
Author_Institution :
Adv. Packaging, Kulicke & Soffa Ind. Inc., Willow Grove, PA, USA
Abstract :
As wire bonding continues to advance, new challenges are resolved. In ultra-fine pitch bonding (<50μm pitch), efforts to maximize wire diameter have resulted in specialized contained inner chamfer (CIC) capillaries, that reduce friction between the wire and feed hole, allowing the use of larger diameter wire without feed and interference problems. New wires have been developed that provide significantly improved intermetallic reliability after thermal aging of small diameter ball bonds. Bonders with improved z-axis control provide greater control of impact forces for improved intermetallic formation and coverage.
Keywords :
fine-pitch technology; integrated circuit bonding; integrated circuit interconnections; integrated circuit reliability; ball bonds; contained inner chamfer capillaries; feed problems; impact forces control; improved z-axis control; interference problems; intermetallic coverage; intermetallic formation; intermetallic reliability improvements; reduced friction; thermal aging; ultra-fine pitch bonding; wire bonding; wire diameter maximization; Aluminum; Bonding; Feeds; Frequency; Friction; Guidelines; Intermetallic; Packaging; Robustness; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
Print_ISBN :
0-7803-8582-9
DOI :
10.1109/IEMT.2004.1321655
