Title :
Considerations for the use of plasma in pre-wire bond applications
Author_Institution :
March Plasma Syst., Concord, CA, USA
Abstract :
Integrated circuits continue to shrink in size, and the associated decrease in size of the wire bond pad on both the die and substrate presents substantial challenges in the manufacturing process. To ensure high device reliability and minimize manufacturing costs, it is important to optimize the wire bonding process to ensure good bond strengths and yields. Poor bond strengths and low yields are often due to upstream contamination sources or the selection of materials in advanced packaging. Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields. Examples specific to epoxy bleed-out contamination and considerations regarding substrate material and device characteristics are discussed.
Keywords :
integrated circuit bonding; integrated circuit packaging; integrated circuit reliability; manufacturing processes; plasma materials processing; surface cleaning; surface contamination; advanced packaging; bond strengths; contamination sources; device characteristics; device reliability; epoxy bleed-out contamination; gas plasma technology; integrated circuits; manufacturing costs minimization; manufacturing process; pre-wire bond applications; substrate material; wire bond pad; wire bonding process optimizations; Bonding processes; Contamination; Cost function; Integrated circuit reliability; Manufacturing processes; Packaging; Plasma applications; Plasma devices; Plasma materials processing; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
Print_ISBN :
0-7803-8582-9
DOI :
10.1109/IEMT.2004.1321659
