• DocumentCode
    3289493
  • Title

    New Topological Structure of Combination Switch Based Reactive Power Compensation Installation

  • Author

    Wang, Fei

  • Author_Institution
    Key Lab. of Power Syst. Protection & Dynamic Security Monitoring & Control under Minist. of Educ., North China Electr. Power Univ., Baoding, China
  • fYear
    2009
  • fDate
    16-17 May 2009
  • Firstpage
    368
  • Lastpage
    371
  • Abstract
    A new topological structure of combination switch based reactive power compensation installation is presented in this paper. The new topological structure overcomes those shortcomings of traditional product satisfactorily by take advantage of the features of new system topological structure: concise structure, flexible configuration, high speed communication and powerful capacity of resisting disturbance. The new system topological structure and software program design features of this new installation are described in detail, contrastive analysis and practical test between the new installation and the traditional product are discussed. The results show that the new installation not only has the virtue of: structural standard, simply connection, intelligent identification, easy to extend, high reliability and high power density, but also improves the performance index by means of integrated intelligent control principle and compensation capacity dynamic modification.
  • Keywords
    compensation; controller area networks; field buses; installation; reactive power; combination switch; compensation capacity dynamic modification; integrated intelligent control principle; performance index; reactive power compensation installation; software program design; topological structure; Access protocols; Communication system control; Control systems; ISO standards; Low voltage; Power system dynamics; Power system reliability; Reactive power; Reactive power control; Switches; Topological structure; combination switch; reactive power compensation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits, Communications and Systems, 2009. PACCS '09. Pacific-Asia Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-0-7695-3614-9
  • Type

    conf

  • DOI
    10.1109/PACCS.2009.169
  • Filename
    5232363