DocumentCode
3289635
Title
Non-contact fast wafer metrology for ultra-thin patterned wafers mounted on grinding and dicing tapes
Author
Walecki, Wojciech ; Suchkov, Vitali ; Van, Phuc ; Lai, Kevin ; Pravdivtsev, Alexander ; Mikhaylov, Georgy ; Lau, S.H. ; Koo, Ann
Author_Institution
Frontier Semicond., San Jose, CA, USA
fYear
2004
fDate
July 14-16, 2004
Firstpage
323
Lastpage
325
Abstract
We present application of low coherence optical interferometry to measurement of highly warped samples(characterized by bow of up to 8mm and beyond on 300mm diameter wafers).
Keywords
electromagnetic wave interferometers; flaw detection; light coherence; nondestructive testing; printed circuit testing; printed circuits; coherence; dicing tapes; grinding tapes; noncontact fast wafer metrology; optical interferometry; ultra-thin patterned wafers; Lenses; Lighting control; Metrology; Mirrors; Optical beams; Optical collimators; Optical control; Optical interferometry; Optical polarization; Optical sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
ISSN
1089-8190
Print_ISBN
0-7803-8582-9
Type
conf
DOI
10.1109/IEMT.2004.1321683
Filename
1321683
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