DocumentCode :
3289635
Title :
Non-contact fast wafer metrology for ultra-thin patterned wafers mounted on grinding and dicing tapes
Author :
Walecki, Wojciech ; Suchkov, Vitali ; Van, Phuc ; Lai, Kevin ; Pravdivtsev, Alexander ; Mikhaylov, Georgy ; Lau, S.H. ; Koo, Ann
Author_Institution :
Frontier Semicond., San Jose, CA, USA
fYear :
2004
fDate :
July 14-16, 2004
Firstpage :
323
Lastpage :
325
Abstract :
We present application of low coherence optical interferometry to measurement of highly warped samples(characterized by bow of up to 8mm and beyond on 300mm diameter wafers).
Keywords :
electromagnetic wave interferometers; flaw detection; light coherence; nondestructive testing; printed circuit testing; printed circuits; coherence; dicing tapes; grinding tapes; noncontact fast wafer metrology; optical interferometry; ultra-thin patterned wafers; Lenses; Lighting control; Metrology; Mirrors; Optical beams; Optical collimators; Optical control; Optical interferometry; Optical polarization; Optical sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International
ISSN :
1089-8190
Print_ISBN :
0-7803-8582-9
Type :
conf
DOI :
10.1109/IEMT.2004.1321683
Filename :
1321683
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3289635
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