Title :
Pad characterization for CMOS technology using time domain reflectometry
Author :
Chiu, C.S. ; Chen, W.L. ; Liao, K.H. ; Chen, B.Y. ; Teng, Y.M. ; Huang, G.W. ; Wu, L.K.
Abstract :
The pad structure of CMOS technology is characterized by way of time domain reflectometry measurement. Using the on-wafer TDR measurement system, the capacitance of the pad in the CMOS process was extracted and estimated. Measured and simulated TDR data are also presented in this study. The capacitance is estimated when the curve is fitted by mathematical tool. This method is simple to use, and furthermore the results agree with data extracted from vector network analyzer.
Keywords :
CMOS integrated circuits; curve fitting; network analysers; time-domain reflectometry; CMOS technology; capacitance; curve fitting; data extraction; mathematical tool; on-wafer TDR measurement system; pad characterization; time domain reflectometry measurement; vector network analyzer; CMOS technology; Reflectometry; Capacitance; Impedance; On-wafer; Pad structure; Time domain reflectometry (TDR);
Conference_Titel :
RF and Microwave Conference, 2008. RFM 2008. IEEE International
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4244-2866-3
Electronic_ISBN :
978-1-4244-2867-0
DOI :
10.1109/RFM.2008.4897398
