Reliability Testing of Polytronics Components in the Micro-Nano Region

Reliability testing of polytronics components has found much attention recently, because of the growing practical importance of polytronics. There has been a growing need for a better knowledge of local materials parameters, local deformation as well stress fields. Interface crack and delamination phenomena have also moved to the focus of reliability estimations for polytronics. Creep and fatigue on the other hand can be described by means of local micro- and nanomaterials testing combined with advanced reliability and life-time concepts. The authors are going to discuss a combined experimental and simulation approach to improve the classical reliability analysis. The approach is based upon various digital image correlation (DIC) techniques, e.g. microDIC, nanoDIC and fibDIC, as well as related methods involving AFM, SEM or FIB, too.