DocumentCode
3290521
Title
Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications
Author
Morris, James E. ; Lee, Jeahuck ; Liu, Johan
Author_Institution
Department of Electrical & Computer Engineering, Portland State University, P.O. Box 751, Portland, OR 97207-0751, USA
fYear
2005
fDate
23-26 Oct. 2005
Firstpage
45
Lastpage
52
Abstract
This paper is intended to provide an initial resource for researchers and practitioners entering the isotropic conductive adhesive (ICA) field, but may also prove useful to those with prior experience. It presents an historical overview of the issues confronted in ICA development and use in various electronics packaging applications in place of soldering technology.
Keywords
Application software; Conductive adhesives; Conductivity; Electronics packaging; Independent component analysis; Lead; Polymers; Powders; Surface-mount technology; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, Polytronic, 2005. Polytronic 2005. 5th International Conference on
Print_ISBN
0-7803-9553-0
Type
conf
DOI
10.1109/POLYTR.2005.1596485
Filename
1596485
Link To Document