• DocumentCode
    3290595
  • Title

    A top-down microsystems design methodology and associated challenges

  • Author

    McCorquodale, Michael S. ; Gebara, Fadi H. ; Kraver, Keith L. ; Marsman, Eric D. ; Senger, Robert M. ; Brown, Richard B.

  • Author_Institution
    Solid State Electron. Lab., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    2003
  • fDate
    2003
  • Firstpage
    292
  • Abstract
    An overview of microsystems technology is presented along with a discussion of the recent trends and challenges associated with its development. A typical bottom-up design methodology is described and we propose, in contrast, an efficient and effective top-down methodology. We illustrate its implementation with the development of a microsystem design that has been completed and fabricated in CMOS technology. Gaps in the tool capabilities are identified and suggestions for future directions in CAD tool support for microsystems technology are presented.
  • Keywords
    CMOS integrated circuits; circuit CAD; integrated circuit design; microcomputers; micromechanical devices; mixed analogue-digital integrated circuits; CAD tool support; CMOS technology; MEMS; actuating functions; bottom-up design; integrated circuit CAD tools; microelectromechanical systems; microsystems technology; mixed-signal circuit design; processing functions; sensing functions; top-down microsystems design methodology; CMOS technology; Chemical technology; Design automation; Design methodology; Digital integrated circuits; Hardware design languages; Magnetic domains; Micromechanical devices; Microprocessors; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe Conference and Exhibition, 2003
  • ISSN
    1530-1591
  • Print_ISBN
    0-7695-1870-2
  • Type

    conf

  • DOI
    10.1109/DATE.2003.1186711
  • Filename
    1186711