DocumentCode
3290595
Title
A top-down microsystems design methodology and associated challenges
Author
McCorquodale, Michael S. ; Gebara, Fadi H. ; Kraver, Keith L. ; Marsman, Eric D. ; Senger, Robert M. ; Brown, Richard B.
Author_Institution
Solid State Electron. Lab., Michigan Univ., Ann Arbor, MI, USA
fYear
2003
fDate
2003
Firstpage
292
Abstract
An overview of microsystems technology is presented along with a discussion of the recent trends and challenges associated with its development. A typical bottom-up design methodology is described and we propose, in contrast, an efficient and effective top-down methodology. We illustrate its implementation with the development of a microsystem design that has been completed and fabricated in CMOS technology. Gaps in the tool capabilities are identified and suggestions for future directions in CAD tool support for microsystems technology are presented.
Keywords
CMOS integrated circuits; circuit CAD; integrated circuit design; microcomputers; micromechanical devices; mixed analogue-digital integrated circuits; CAD tool support; CMOS technology; MEMS; actuating functions; bottom-up design; integrated circuit CAD tools; microelectromechanical systems; microsystems technology; mixed-signal circuit design; processing functions; sensing functions; top-down microsystems design methodology; CMOS technology; Chemical technology; Design automation; Design methodology; Digital integrated circuits; Hardware design languages; Magnetic domains; Micromechanical devices; Microprocessors; Wireless sensor networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe Conference and Exhibition, 2003
ISSN
1530-1591
Print_ISBN
0-7695-1870-2
Type
conf
DOI
10.1109/DATE.2003.1186711
Filename
1186711
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