DocumentCode :
3290834
Title :
Polymer Overmoulding for Microfluidic Device Packaging and System Integration
Author :
Webb, D.P. ; Hsu, C.C. ; Hutt, D.A. ; Hopkinson, N. ; Conway, P.P. ; Palmer, P.J.
Author_Institution :
School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leicestershire LE11 3TU, U.K., D.P.Webb@lboro.ac.uk
fYear :
2005
fDate :
23-26 Oct. 2005
Firstpage :
134
Lastpage :
139
Abstract :
Packaging of microfluidics receives relatively little academic attention, and most published work concerns the facilitation of prototyping rather than schemes suitable for volume production. A new packaging method for microfluidic devices is proposed, of polymer overmoulding to form a fluidic manifold integrated with the device in a single step. The anticipated advantages of the proposed method of packaging are ease of assembly and low part count, making it suitable for low cost, high volume manufacturing. The work reported here is an investigation into the fundamental materials and process issues determining the feasibility of the proposed packaging method.
Keywords :
adhesion; fluidic interconnection; lab-on-a-chip; microfluidic packaging; Adhesives; Connectors; Costs; Fluidic microsystems; Glass; Manufacturing; Microfluidics; Packaging; Polymers; Robustness; adhesion; fluidic interconnection; lab-on-a-chip; microfluidic packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, Polytronic, 2005. Polytronic 2005. 5th International Conference on
Print_ISBN :
0-7803-9553-0
Type :
conf
DOI :
10.1109/POLYTR.2005.1596503
Filename :
1596503
Link To Document :
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