DocumentCode
3290855
Title
Investigation of Environmental Reliability of Optical Polymer Waveguides Embedded on Printed Circuit Boards
Author
Immonen, Marika ; Karppinen, Mikko ; Kivilahti, Jorma K.
Author_Institution
Aspocomp Oy, Sinikalliontie 11, FIN-02630 Espoo, Finland
fYear
2005
fDate
23-26 Oct. 2005
Firstpage
145
Lastpage
151
Abstract
In this paper, the effects of environmental stresses on the properties of polymer optical waveguides were studied. Optical multimode waveguides were fabricated on printed circuit boards using commercial polymers. The stability of the optical properties of the guide systems was investigated in damp heat-high humidity, high temperature storage, thermal shock and in environmental flowing multigas tests. Aging at high temperature and temperature cycling reduced the refractive index to largest extent. The optical build-up (o-BU) structure in which the optical layer was fabricated on the board surface was observed to be vulnerable under temperature shock when compared with the structure where the optical layer was laminated inside the FR4/Cu boards. The buffer layer beneath the optical build-up was found to improve the stability of the optical waveguides significantly.
Keywords
Optical interconnects; optical printed circuit boards; photonics reliability; polymer waveguides; Circuit stability; Electric shock; Optical buffering; Optical polymers; Optical refraction; Optical variables control; Optical waveguides; Printed circuits; Temperature; Thermal stresses; Optical interconnects; optical printed circuit boards; photonics reliability; polymer waveguides;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, Polytronic, 2005. Polytronic 2005. 5th International Conference on
Print_ISBN
0-7803-9553-0
Type
conf
DOI
10.1109/POLYTR.2005.1596505
Filename
1596505
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