• DocumentCode
    3290981
  • Title

    Signal and power integrity analysis for the novel power plane of EBG structure in high-speed mixed signal systems

  • Author

    Hao-Ran Zhu ; Jun-Fa Mao ; Jian-Jie Li

  • Author_Institution
    Key Lab. of Minist. of Educ. of China for Res. of Design & Electromagn. Compatibility of High Speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2013
  • fDate
    14-18 April 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, a novel power plane of electromagnetic bandgap (EBG) structure for wideband mitigation of simultaneous switching noise (SSN) in mixed signal systems is proposed. Complementary split ring resonator (CSRR) with inherent filtering characteristic is utilized for constituting EBG unit cells. From the simulated and measured results of the proposed EBG structure, a wideband suppression of SSN ranges from 0.56 GHz to 5.88 GHz is achieved with a high mitigation level of -40 dB. Furthermore, the influence of the proposed power plane of EBG structure on the signal integrity (SI) is investigated in the time and frequency domains, respectively. The results show that the SI performance can be improved significantly by using differential pairs for the signals.
  • Keywords
    frequency-domain analysis; microwave materials; microwave resonators; photonic band gap; time-domain analysis; EBG structure; SSN; complementary split ring resonator; differential pair; electromagnetic bandgap structure; frequency 0.56 GHz to 5.88 GHz; frequency domain analysis; high-speed mixed signal systems; power integrity analysis; power plane; signal integrity analysis; simultaneous switching noise; time domain analysis; Couplings; Inductance; Metamaterials; Noise; Periodic structures; Silicon; Substrates; Complementary split ring resonator (CSRR); differential pair; electromagnetic bandgap structure (EBG); power integrity (PI); signal integrity (SI);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Symposium (IWS), 2013 IEEE International
  • Conference_Location
    Beijing
  • Type

    conf

  • DOI
    10.1109/IEEE-IWS.2013.6616701
  • Filename
    6616701