Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation

Author

Zhang, Yan ; Larsson, Ragnar ; Fan, Jingyu ; Cheng, Zhaonian ; Liu, Johail

Author_Institution

Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, Shanghai 200072, China; Department of Applied Mechanics, Chalmers University of Technology, Se-412 96, Gothenburg, Sweden

fYear

2005

fDate

23-26 Oct. 2005

Firstpage

176

Lastpage

179

Abstract

In this paper, the micro-polar theory is used to develop a numerical model for the prediction of the behavior of the material in the vicinity of the microsystem interconnection interface as well within the interface. This model, as compared with the classical continuum theory, can offer the possibility to include the size-effect for the simulation and prediction of the microsystem packaging interconnection materials. The model has been carried out in a finite element environment, and some examples are given as the application of the model.

Keywords

Micro-polar theory; Microsystem packaging; discontinuous approximation; Bonding; Conducting materials; Conductive adhesives; Displays; Electronic mail; Electronics packaging; Polymers; Predictive models; Stress; Thermal degradation; Micro-polar theory; Microsystem packaging; discontinuous approximation;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, Polytronic, 2005. Polytronic 2005. 5th International Conference on

Print_ISBN

0-7803-9553-0

Type

conf

DOI

10.1109/POLYTR.2005.1596512

Filename

1596512