Title :
Linking Sensors With Telemetry: Impact On The System Design
Author_Institution :
Katholieke Universiteit Leuven
Keywords :
Biomedical monitoring; Condition monitoring; Energy consumption; Joining processes; Packaging; Sensor systems; Silicon; Telemetry; Temperature sensors; Transducers;
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
DOI :
10.1109/SENSOR.1995.717079
