Title :
In Situ Investigation Of Precise High Strength Micro Assembly Using Au-Si Eutectic Bonding
Author :
Tiensuu, A.-L. ; Schweitz, J.A. ; Johansson, S.
Author_Institution :
Uppsala University
Keywords :
Assembly; Force measurement; Gold; Heating; Micromachining; Monitoring; Silicon; Substrates; Temperature; Wafer bonding;
Conference_Titel :
Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on
Print_ISBN :
91-630-3473-5
DOI :
10.1109/SENSOR.1995.717153
