DocumentCode

329174

Title

In Situ Investigation Of Precise High Strength Micro Assembly Using Au-Si Eutectic Bonding

Author

Tiensuu, A.-L. ; Schweitz, J.A. ; Johansson, S.

Author_Institution

Uppsala University

Volume

1

fYear

1995

fDate

25-29 Jun 1995

Firstpage

236

Lastpage

239

Keywords

Assembly; Force measurement; Gold; Heating; Micromachining; Monitoring; Silicon; Substrates; Temperature; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors and Actuators, 1995 and Eurosensors IX.. Transducers '95. The 8th International Conference on

Print_ISBN

91-630-3473-5

Type

conf

DOI

10.1109/SENSOR.1995.717153

Filename

717153